发明名称 METHOD FOR MAKING A SEMICONDUCTOR STRUCTURE USING SILICON GERMANIUM
摘要 Silicon carbon is used as a diffusion barrier (18,108) to germanium so that a silicon layer (20,110) can be subsequently formed without being contaminated with germanium. This is useful in separating silicon layers (20, 110) from silicon germanium layers (16,106) in situations in which both silicon and silicon germanium are desired to be present on the same semiconductor device (10) such as for providing different materials for optimizing carrier mobility between N and P channel transistors (27) and for a raised source/drain (134,136) of silicon in the case of a silicon germanium body.
申请公布号 WO2005117101(A3) 申请公布日期 2006.06.01
申请号 WO2005US12391 申请日期 2005.04.13
申请人 FREESCALE SEMICONDUCTOR, INC.;ORLOWSKI, MARIUS K.;LIU, CHUN-LI;YEAP, CHOH-FEI 发明人 ORLOWSKI, MARIUS K.;LIU, CHUN-LI;YEAP, CHOH-FEI
分类号 H01L21/336;H01L21/8234;H01L29/08;H01L29/10;H01L29/739;H01L29/78;H01L29/786;H01L31/117 主分类号 H01L21/336
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