| 摘要 |
PROBLEM TO BE SOLVED: To increase the sensitivity and to reduce the cost by certain and simple vacuum sealing in an infrared sensor. SOLUTION: The infrared sensor 1 comprises an infrared sensing section 5 that is formed on a silicon substrate 2 and receives infrared rays to vary the output, a first structure 3 made of glass so as to surround the sensing section 5, and a second structure 4 that is located in the upper part of the first structure 3 and made of silicon. A joint 6 between the silicon substrate 2 having the sensing section 5 and the first structure 3 and a joint 7 between the first structure 3 and the second structure 4 are formed by positive electrode joining, respectively. The space 10 surrounded by the silicon substrate 2 having the sensing section 5, the first structure 3, and the second structure 4, namely the space 10 surrounding the sensing section 5, is vacuum. COPYRIGHT: (C)2006,JPO&NCIPI
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