发明名称 TEMPERATURE MEASURING SUBSTRATE FOR SUBSTRATE HEAT TREATMENT FURNACE
摘要 PROBLEM TO BE SOLVED: To provide a temperature measuring substrate for a substrate heat treatment furnace capable of measuring accurately a temperature distribution when performing heat treatment of an actual substrate without projection of a hot contact part from the substrate surface even if the substrate is thinned. SOLUTION: A pair of through-holes penetrating mutually at an interval are open-cut on the bottom part of many recessed parts scattered on the surface of a dummy substrate having the same shape and the same material as the actual substrate, and a storage hole is formed on the bottom part of the recessed parts in the positioned state between the pair of through-holes. As for a thermocouple, a pair of thermocouple elements are brought into close to contact with the bottom surface of the recessed parts, and in the state where the hot contact part expanded at the tip of the thermocouple element is engaged from the recessed part into the storage hole, a heat-resistant fixing agent is filled into the recessed part, to thereby bury the thermocouple elements into the recessed part. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006138637(A) 申请公布日期 2006.06.01
申请号 JP20040325884 申请日期 2004.11.10
申请人 KAWASO ELECTRIC INDUSTRIAL CO LTD 发明人 UEMURA TAKAAKI
分类号 G01K7/02;H01L21/66 主分类号 G01K7/02
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