The present invention relates to a processing apparatus, such as a laminator, for performing operations involving effecting adhesive bonding on substrates.
申请公布号
US2006113029(A1)
申请公布日期
2006.06.01
申请号
US20050261933
申请日期
2005.10.31
申请人
发明人
LEMENS PAUL J.;HOLMAN CHRISTOPHER A.;BECKER ADAM J.;GOODFELLOW ANDREW
