| 摘要 |
PROBLEM TO BE SOLVED: To secure the strength of an insulating film while securing insulation between adjacent electrode structures even if the arrangement pitch of the electrode structures is short in a sheet-like probe, which is used for electrical inspection on circuit devices such as large wafers in which electrodes to be inspected of, for example, fine pitch are formed, and in which the electrode structures to be connected to the electrodes to be inspected of the circuit devices are penetrated through and supported at the insulating film and a contact film is supported at a support. SOLUTION: Both a first sheet 24 in which surface electrodes 17a are raised from the surface of a metal sheet 21 and a second sheet in which a porous film 11, namely the support, is integrated with the insulating film 16 and through-holes 30 are formed by etching from both surface sides of the insulating film 16 are overlaid on each other in such a way that the surface electrodes 17a may be inserted in the through-holes 30. The electrode structures 17 are formed by plating the inside of the through-holes 30. COPYRIGHT: (C)2006,JPO&NCIPI
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