| 摘要 |
A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second plated through hole is disclosed. The first laminated structure has at least three first circuit layers and at last two first dielectric layers. The first circuit layers and the first dielectric layers are alternately laminated and any two adjacent first circuit layers have a first dielectric layer disposed between them. The first plated through hole passes through the first laminated layer. The second laminated structure is laminated over the first laminated structure. The middle dielectric layer is disposed between the first laminated structure and the second laminated structure. The second plated through hole passes through the first laminated structure, the middle dielectric layer and the second laminated structure.
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