| 摘要 |
An embodiment of the invention provides a semiconductor component and method of forming thereof. The component comprises a dielectric layer over a substrate, and a layer of an organic compound covalently bonded to the dielectric layer. The organic compound has a chemical functionality selected from the group consisting essentially of a silicon-halogen, a silicon-alkoxy group, an amino group, an amide group, a reactive carboxylic acid derivative, a chloride ester, or an ortho ester. The organic compound may further include a polar chemical functionality that induces a dipole moment in the organic compound. The organic compound may be arranged as a monolayer on the dielectric layer. An organic semiconducting layer is formed on the layer of the organic compound.
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