发明名称 MARKING METHOD AND SHEET USED BOTH FOR PROTECTIVE FILM FORMATION AND FOR DICING
摘要 <P>PROBLEM TO BE SOLVED: To provide a marking method for marking a protective film with sufficient accuracy by suppressing the curvature of a work in the process where marking is carried out to the protective film formed in the work, and to provide a sheet used suitably in the both methods for protective film formation and for dicing. <P>SOLUTION: The marking method is carried out by marking the protective film by using laser beam irradiation to this protective film from the support film side in the laminated state constituted of the support film stretched by the ring frame on which the protective film is laminated freely of exfoliation where the work is fixed. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140348(A) 申请公布日期 2006.06.01
申请号 JP20040329418 申请日期 2004.11.12
申请人 LINTEC CORP 发明人 SAEKI NAOYA;SHINODA TOMONORI;NAKAGISHI AKIE
分类号 H01L21/301 主分类号 H01L21/301
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