发明名称 POWER LED AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a power LED wherein a plurality of LED chips mounted at a high density are resin-sealed, which can keep a high reliability without being influenced by a change in thermal stress of the sealing resin when the LED chips light up or turn off, and which can suppress a change of characteristic such as output and color tone, and also to provide its manufacturing method. <P>SOLUTION: The plurality of LED chips 3 are mounted at a high density on a metal stem 2 from which a plurality of leads 1 formed of a conductive material are extracted outside. Then, a lens holder 6 to which a glass lens 7 is temporarily fastened by silicone resin is so welded and integrated on the metal stem 2 as to surround the LED chips 3. Thereafter, silicone resin having translucency and flexibility is injected as the sealing resin 10 into a space formed by the metal stem 2, lens holder 6, and glass lens 7 to resin-seal the LED chips 3 and bonding wires 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140281(A) 申请公布日期 2006.06.01
申请号 JP20040327878 申请日期 2004.11.11
申请人 STANLEY ELECTRIC CO LTD 发明人 IWASAKI KAZUYUKI;SUZUKI FUSAO
分类号 H01L33/58;H01L33/62 主分类号 H01L33/58
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