| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductive seamless belt capable of realizing smaller size of equipment, higher printing speed, and longer operating life of equipment without sticking a reinforcing tape, etc., because the belt has satisfactory cracking resistance of both edge portions, and to provide a method for manufacturing the belt. SOLUTION: A conductive agent content of both edge portions of the semiconductive seamless belt is reduced toward the edges. In the method for manufacturing the semiconductive seamless belt, when a liquid material C is applied from a nozzle 2 on the peripheral surface of a cylindrical substrate 1 while rotating the substrate 1 to form a nearly cylindrical coating film comprising a continuous spiral coating film 4, a conductive agent content of the liquid material C is gradually increased in an initial portion, an increased final value is kept in a middle portion and the final value is gradually reduced in a terminal portion. COPYRIGHT: (C)2006,JPO&NCIPI |
