发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To enhance the strength of a COG (Chip On Glass) mounted semiconductor chip 20 against the impact or the like. SOLUTION: A liquid display panel 1 comprises a semiconductor chip 20 that has a circuit surface 22 formed with a circuit, and a rear surface 23 that is formed on the back of the circuit surface 22 and does not have a circuit; and a glass substrate 10 having the semiconductor chip 20 mounted on the circuit surface 22. A resin 30 is applied only to the rear surface 23 of the semiconductor chip 20. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006140358(A) 申请公布日期 2006.06.01
申请号 JP20040329650 申请日期 2004.11.12
申请人 SHARP CORP 发明人 NAGAOKA HAJIME
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址