| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for making sure of electrical connection with a terminal of a semiconductor package while reducing deformation of the terminal as much as possible. SOLUTION: A socket 10 includes a base member 20, a cover member 30, a plurality of contacts 40 and an adapter 60. Each contact 40 has one end 41 fixed to the base member 20 and an elastic deformation part 44 between the one end 41 and the other end 42, and further, a pair of acute-angled projections 46a, 46b is formed at the other end of the contact 40. The adopter 60 is attached on the base member 20 so as to move up and down and has a mounting surface 61 to mount a BGA package 1 thereon. A plurality of through-holes 65 are formed at the positions corresponding to the other ends 42 of the plurality of contacts 40 on the mounting surface 61. When the BGA package 1 is mounted on the mounting surface 61, the one pair of projections 46a, 46b of the other ends of each contact 40 contacts with solder balls 3 of the BGA package 1. COPYRIGHT: (C)2006,JPO&NCIPI
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