发明名称 Cooling system of power semiconductor module
摘要 A cooling system of a power semiconductor module of the invention includes a temperature detection sensor provided in a semiconductor element as a heat source provided in a power semiconductor module, and a controller which estimates a change of a heat transfer coefficient from the power semiconductor module to cooling water based on output information Tj of the temperature detection sensor and drive output information Sr of a rotation speed detection sensor for a pump motor to drive a cooling pump, controls the pump motor according to this estimated result, and controls cooling capacity of the cooling water.
申请公布号 US2006113661(A1) 申请公布日期 2006.06.01
申请号 US20050186982 申请日期 2005.07.22
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YAMABUCHI HIROSHI;NISHIYAMA RYOJI;KURAMOTO YUJI;ISHIBASHI SATOSHI
分类号 H01L23/34 主分类号 H01L23/34
代理机构 代理人
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