<p>Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ from the arrangement of contacts in a connector the footprint is designed to receive. The terminal ends of the contacts may be jogged or bent for electrical connection with the SMT pads. The SMT pads and vias may be arranged in a number of ways that increase signal contact density of the board, while limiting cross-talk and providing adequate impedance and routing space on the board. An interactive tool for designing such a footprint is disclosed.</p>
申请公布号
WO2006058311(A2)
申请公布日期
2006.06.01
申请号
WO2005US43028
申请日期
2005.11.29
申请人
FCI AMERICAS TECHNOLOGY, INC.;FCI;WININGS, CLIFFORD, L.;SHUEY, JOSEPH, B.