发明名称 |
COMPONENT MOUNTING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component mounting method which improves production efficiency of a component mounting apparatus. <P>SOLUTION: In the component mounting method of a component mounting apparatus to mount components to a substrate, the component mounting apparatus is provided with a component supplying unit which accommodates components and includes a plate 160 capable of setting a plurality of trays 162. Each of a plurality of trays 162 accommodates a plurality of components of the same kind on the trays 162 or is a vacant tray not accommodating component. The component mounting method comprises an allocation information accepting step for accepting the allocation information indicating the kind and allocating position of the tray 162 allocated on the plate 160 and a mounting step for mounting components on the substrate on the basis of the allocation information accepted in the allocation information accepting step. The allocation information has no restriction on the kind of trays allocated in each tray 162 on the plate 160. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006140255(A) |
申请公布日期 |
2006.06.01 |
申请号 |
JP20040327452 |
申请日期 |
2004.11.11 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YOSHIDA HIROYUKI;HIRATA SHUICHI;TSUJISAWA TAKAFUMI;INOUE KENJI;TAKURI AKIYOSHI |
分类号 |
H05K13/04;H05K13/02 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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