发明名称 |
Semiconductor die attachment for high vacuum tubes |
摘要 |
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom. |
申请公布号 |
US2006113655(A1) |
申请公布日期 |
2006.06.01 |
申请号 |
US20060324074 |
申请日期 |
2006.01.03 |
申请人 |
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发明人 |
COSTELLO KENNETH A.;RODERICK KEVIN J. |
分类号 |
H01L23/24;B23K5/00;B23K31/02;H01L21/60;H01L23/053 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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