发明名称 COVER TAPE FOR PACKAGING ELECTRONIC ELEMENTS
摘要 A COVER TAPE (1) FOR PACKAGING ELECTRONIC ELEMENTS CAPABLE OF BEING HEAT-SEALED TO A POLYCARBONATE CARRIER TAPE (7) HAVING REGULARLY FORMED POCKETS FOR CONTAINING ELECTRONIC ELEMENTS, WHICH COVER TAPE (1) COMPRISES (A) A SUBSTRATE LAYER (2) COMPRISING A THERMOPLASTIC RESIN HAVING A LOAD DEFLECTION TEMPERATURE (ASTM D-648) UNDER A LOAD OF 1.82 MPA OF NOT LOWER THAN 60°C, AND (B) A HEAT SEAL LAYER (3) COMPRISING AT LEAST ONE RESIN SELECTED FROM POLYVINYL CHLORIDE RESIN, POLYESTER RESIN, POLYURETHANE RESIN, ACRYLIC RESIN CONTAINING A FUNCTIONAL GROUP AND ETHYLENE COPOLYMER WHICH HAVE A TG OF 30-60°C, AND AN ELECTROCONDUCTIVE FINE POWDER DISPERSED IN SAID RESIN.
申请公布号 MY122946(A) 申请公布日期 2006.05.31
申请号 MYPI20024864 申请日期 2002.12.24
申请人 SUMITOMO BAKELITE COMPANY LIMITED 发明人 TSUYOSHI MARUMO;HISAO NAKANISHI
分类号 B65D85/86;B32B27/08;B32B27/18;B32B27/30;B65D65/40;H01L21/00;H01L21/68 主分类号 B65D85/86
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