Semiconductor package

摘要

A semiconductor package is comprised of a semiconductor device 4 mounted on a die-pad 3, a wire 6 for electrically connecting some electrodes of the semiconductor device 4 and terminals 5 of lead frame, wires 8 for bonding the other electrodes of semiconductor device to the surface of die-pad for grounding, molding compound 7 for encapsulating the outer area of semiconductor device 4 under a state where the back face of die-pad 3, the lower face and side face of terminals 5 are exposed, wherein portions for plated with silver connecting of wires on the surface of the die-pad are formed at points positioned between a peripheral edge of the die-pad and an outer edge of the semiconductor device with leaving spaces from both the edges. The adhesion of die-pad 3 to bonding compound 7 is improved so that no trouble of coming-off of wires occur even if heat is applied to the contact points of die-pad 3 to wires 8 when mounting semiconductor package on a printed circuit board.