Method of processing objects comprising a surface portion made of an insulator

摘要

The invention provides an electrostatically chucking technology capable of chucking a workpiece formed of an insulator or a workpiece (15) attached with an object to be processed such as a semiconductor wafer (7) on a stage (10). A layered body (9) attached with a glass substrate (8) for supporting a semiconductor substrate (7) having an electronic device on its surface is prepared, and a conductive film is attached thereto. Then, the layered body is set on a surface of a stage (10) set in a vacuum chamber (12) such as a dry-etching apparatus. After then, a voltage is applied to an internal electrode to generate positive and negative electric charges on the surfaces of the conductive film and the stage (10), and the layered body (9) is chucked with static electricity generated therebetween. Then, the layered body (9) chucked on the stage (10) is processed by etching, CVD, or PVD.