APPARATUS FOR CONTROLLING THERMAL INTERFACE GAP DISTANCE

摘要

TOLERANCES IN CHIP, SUBSTRATE AND HARDWARE DIMENSIONS ARE ACCOMMODATED BY MEANS OF A FLOATING SEALING STRUCTURE TO INSURE THAT COMPLIANT THERMALLY CONDUCTIVE PASTE DISPOSED BETWEEN THE CHIP AND ITS LID IS AS TRIM AS POSSIBLE IN ORDER TO REDUCE THERMAL RESISTANCE OF THE PASTE SO AS TO BE ABLE TO RUN THE CHIP AT A COOLER TEMPERATURE. STANDOFFS ARE ALSO PREFERABLY EMPLOYED TO INSURE PROPER PASTE GAP THICKNESS.