| 摘要 |
THIS INVENTION IS TO PROPOSE A TECHNIQUE OF PRODUCING A PRINTED WIRING BOARD HAVING AN EXCELLENT ADHESION PROPERTY BETWEEN AN ELECTROLESS PLATED FILM (12) AND AN ELECTROLYTIC PLATED FILM (13) CONSTITUTING A CONDUCTOR CIRCUIT THROUGH A SEMI-ADDITIVE PROCESS WITHOUT CAUSING THE PEELING OF A PLATING RESIST (3) AND IS A PRINTED WIRING BOARD COMPRISING CONDUCTOR CIRCUITS FORMED ON A ROUGHENED SURFACE OF AN INSULATING LAYER, IN WHICH THE CONDUCTOR CIRCUIT IS CONSTITUTED WITH AN ELECTROLESS PLATED FILM(12) AT THE SIDE OF THE INSULATING LAYER AND AN ELECTROLYTIC PLATED FILM (13) AT THE OPPOSITE SIDE AND THE ELECTROLESS PLATED FILM LOCATED AT THE SIDE OF THE INSULATING LAYER IS FORMED SO AS TO F0LLOW TO THE ROUGHENED SURFACE OF THE INSULATING LAYER. THIS PRINTED WIRING BOARD IS PRODUCED BY A SEMI-ADDITIVE METHOD WHEREIN THE ELECTROLESS PLATED FILM IS FORMED ON THE ROUGHENED SURFACE OF THE INSULATING LAYER SO AS TO FOLLOW TO THE ROUGHENED SURFACE OF THE INSULATING LAYER.(FIGURE 12)
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