发明名称 |
HIGH IMPEDANCE SUBSTRATE |
摘要 |
A high-impedance substrate including a first layer made of insulating material, having a lower face and an upper face, the substrate including conductor patterns mechanically linked to the substrate. Some of the conductor patterns mechanically linked to the substrate are associated with a magnetic tile. At least one electrical interconnection puts two points distinct from one another of a conductor pattern mechanically linked to the substrate in electrical contact, this conductor pattern having an assigned magnetic tile, passing above the magnetic tile associated with the conductor pattern mechanically linked to the substrate. |
申请公布号 |
EP1661206(A1) |
申请公布日期 |
2006.05.31 |
申请号 |
EP20040786396 |
申请日期 |
2004.08.30 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
REYNET, OLIVIER;ACHER, OLIVIER;LEDIEU, MARC |
分类号 |
H01Q7/06;H01Q15/00;(IPC1-7):H01Q15/00 |
主分类号 |
H01Q7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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