发明名称 Wafer-Transfervorrichtung und Wafer Transferverfahren.
摘要 A holding device (3) has two rollers (1,2) arranged horizontally and in parallel having ring grooves (10) for holding wafers. A sunken groove at each third ring groove transports wafers (4) up or down between the rollers. Two moving lifting devices (5,6) with holding combs (7,8) for the wafers allow vertical movement.
申请公布号 CH695472(A5) 申请公布日期 2006.05.31
申请号 CH19970002419 申请日期 1997.10.16
申请人 TEC-SEM AG 发明人 STRASSER BERNHARD;BLATTNER JAKOB;SCHMID HANS;BAL CHRISTIAN
分类号 H01L21/68;B65G49/07;H01L21/67;H01L21/673;H01L21/677 主分类号 H01L21/68
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