发明名称 Semiconductor device with heat sink
摘要 A semiconductor device includes a glass substrate, a heat sink formed on the glass substrate and a transistor formed on the heat sink. The transistor includes an active layer formed on the heat sink and having a source region, a channel region and a drain region. A gate electrode is placed on the channel region. In addition, the heat sink may operate as additional gate electrode.
申请公布号 US7053426(B2) 申请公布日期 2006.05.30
申请号 US20040953070 申请日期 2004.09.30
申请人 SANYO ELECTRIC CO., LTD. 发明人 YOKOYAMA RYOICHI;YAMANO KOJI;TAKEDA YASUHIRO;HIROSAWA KOJI
分类号 H01L29/41;H01L29/80;H01L21/00;H01L21/3205;H01L23/34;H01L23/52;H01L29/423;H01L29/49;H01L29/786 主分类号 H01L29/41
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