| 摘要 |
The resist application method comprises the steps of: thermal processing for evaporating water from the surface of a wafer 10 ; making the surface of the wafer 10 hydrophobic with a hydrophobic processing material; and applying a resist onto the wafer 10 , and the step of thermal processing to the step of making the surface of the wafer 10 hydrophobic are performed in a dehumidified atmosphere.
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