发明名称 |
Component mounting control method |
摘要 |
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.
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申请公布号 |
US7051431(B2) |
申请公布日期 |
2006.05.30 |
申请号 |
US20030412675 |
申请日期 |
2003.04.14 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
UEDA YOICHIRO;ICHIHARA MASARU;SATO DAISUKE;TAKANO KEN |
分类号 |
H05K3/30;B23K1/00;H05K13/04;H05K13/08 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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