发明名称 |
Method of manufacturing a semiconductor device |
摘要 |
A technique of using a metal element that has a catalytic action over crystallization of a semiconductor film to obtain a crystalline semiconductor film and then effectively removing the metal element remaining in the film is provided. A first semiconductor film ( 104 ) having a crystal structure is formed on a substrate. A barrier layer ( 105 ) and a second semiconductor film ( 106 ) containing a rare gas element are formed on the first semiconductor film ( 104 ). A metal element contained in the first semiconductor film ( 104 ) is moved to the second semiconductor film ( 106 ) through the barrier layer ( 105 ) by heat treatment for gettering.
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申请公布号 |
US7052943(B2) |
申请公布日期 |
2006.05.30 |
申请号 |
US20020097641 |
申请日期 |
2002.03.15 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;OHNUMA HIDETO;DAIRIKI KOJI;MITSUKI TORU;TAKAYAMA TORU;AKIMOTO KENGO |
分类号 |
H01L21/84;H01L21/77;H01L27/12 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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