发明名称 Method of manufacturing a semiconductor device
摘要 A technique of using a metal element that has a catalytic action over crystallization of a semiconductor film to obtain a crystalline semiconductor film and then effectively removing the metal element remaining in the film is provided. A first semiconductor film ( 104 ) having a crystal structure is formed on a substrate. A barrier layer ( 105 ) and a second semiconductor film ( 106 ) containing a rare gas element are formed on the first semiconductor film ( 104 ). A metal element contained in the first semiconductor film ( 104 ) is moved to the second semiconductor film ( 106 ) through the barrier layer ( 105 ) by heat treatment for gettering.
申请公布号 US7052943(B2) 申请公布日期 2006.05.30
申请号 US20020097641 申请日期 2002.03.15
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;OHNUMA HIDETO;DAIRIKI KOJI;MITSUKI TORU;TAKAYAMA TORU;AKIMOTO KENGO
分类号 H01L21/84;H01L21/77;H01L27/12 主分类号 H01L21/84
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