| 摘要 |
A lead frame may include a plurality of leads, each having a bonding portion electrically connected to a semiconductor chip and an attaching portion. A tape may be provided on the attaching portions of the leads. The attaching portion of each lead may have a width that is smaller than the width of another portion of the lead. A plating layer may be provided on the attaching portion. The lead frame may be implemented in a semiconductor package. |
