| 发明名称 |
PROCESS FOR REMOVING CONTAMINANT FROM A SURFACE AND COMPOSITION USEFUL THEREFOR |
| 摘要 |
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing a fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof or amine group containing acid.
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| 申请公布号 |
KR20060058785(A) |
申请公布日期 |
2006.05.30 |
| 申请号 |
KR20067009275 |
申请日期 |
2006.05.12 |
| 申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
KNEER EMIL A. |
| 分类号 |
B08B3/08;C09K13/06;C09K13/00;C11D7/26;C11D11/00;C23G1/10;H01L21/02;H01L21/304;H01L21/321 |
主分类号 |
B08B3/08 |
| 代理机构 |
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