| 摘要 |
PROBLEM TO BE SOLVED: To enable a resin-sealed semiconductor device composed of two semiconductor chips to be lessened in thickness and improved in electrical properties by a method wherein two semiconductor chips are laminated, and a stray capacitance between the chips is lessened. SOLUTION: A TSOP-type semiconductor device 1 is composed of two semiconductor chips 2 and 3, where the chips 2 and 3 are laminated making their rears bear against each other. Clock enable outer leads through which clock enable signals and chip selection signals are separately inputted are provided to the semiconductor chips 2 and 3. When an operator makes access to one of the semiconductor chips 2 and 3, clock enable signals and chip selection signals are kept in an inactive state, and the other semiconductor chip is get in a low power consumption mode. |
