发明名称 |
System and method for active control of etch process |
摘要 |
A system for regulating an etch process is provided. The system includes one or more light sources, each light source directing light to one or more features and/or gratings on a wafer. Light reflected from the features and/or gratings is collected by a measuring system, which processes the collected light. The collected light is indicative of the dimensions achieved at respective portions of the wafer. The measuring system provides etching related data to a processor that determines the acceptability of the etching of the respective portions of the wafer. The system also includes one or more etching devices, each such device corresponding to a portion of the wafer and providing for the etching thereof. The processor selectively controls the etching devices to regulate etching of the portions of the wafer.
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申请公布号 |
US7052575(B1) |
申请公布日期 |
2006.05.30 |
申请号 |
US20010845454 |
申请日期 |
2001.04.30 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
RANGARAJAN BHARATH;SINGH BHANWAR;SUBRAMANIAN RAMKUMAR |
分类号 |
C23F1/00 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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地址 |
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