| 摘要 |
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness. |
