发明名称 |
Bond pad for flip chip package |
摘要 |
A bond pad for a flip chip package. The bond pad is suitable for an integrated circuit chip. A plurality of slots are designed in the bond pad. Each of the slots extends along a direction which is perpendicular to a radial direction from the center of the bond pad. The bond pad is deposed at the corner of the integrated circuit chip. |
申请公布号 |
SG121890(A1) |
申请公布日期 |
2006.05.26 |
申请号 |
SG20040003785 |
申请日期 |
2004.06.14 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HUANG TAI-CHUN;YAO CHIH-HSIANG;HSIEH CHING-HUA |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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