| 摘要 |
A semiconductor device includes a substrate, a semiconductor element mounted on the substrate, a heat diffusing member, which covers the semiconductor element and is mounted on the substrate, and a sealing resin which covers the semiconductor element. An integrated capacitor is mounted on the heat diffusing member by facing the semiconductor element, and is electrically connected with the semiconductor element. A terminal of the integrated capacitor is connected with a terminal of the semiconductor element at the shortest distance. Furthermore, the heat diffusing member includes a first metal plate and a second metal plate, which are separated by an insulating layer, and a part of the terminals of the integrated capacitor is connected with a corresponding terminal of the substrate through the first metal plate, and another part of the terminals of the integrated capacitor is connected with a corresponding terminal of the substrate through the second metal plate. Thus, increase of inductance due to an additional capacitor can be suppressed. |
