发明名称 |
DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACKAGE WITH THROUGH VIA CONNECTIONS |
摘要 |
A semiconductor package includes an SOI wafer having a first side including an integrated circuit system, and a second side, opposite the first side, forming at least one cavity. At least one chip or component is placed in the cavity. A through buried oxide via connects the chip(s) to the integrated circuit system. |
申请公布号 |
WO2006053832(A1) |
申请公布日期 |
2006.05.26 |
申请号 |
WO2005EP55734 |
申请日期 |
2005.11.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;CHEN, HOWARD, HAO;HSU, LOUIS, LU-CHEN |
发明人 |
CHEN, HOWARD, HAO;HSU, LOUIS, LU-CHEN |
分类号 |
H01L23/48;H01L21/768;H01L25/065;H01L25/18;H01L29/06 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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