| 发明名称 |
THERMAL PROTECTION FOR ELECTRONIC COMPONENTS DURING PROCESSING |
| 摘要 |
A method and device for cooling an electronic component (16) during its manufacture, repair, or rework. There is a cooling unit (10) in thermal communication with the electronic component (16) which extracts heat therefrom. |
| 申请公布号 |
WO2005069828(A3) |
申请公布日期 |
2006.05.26 |
| 申请号 |
WO2005US01114 |
申请日期 |
2005.01.13 |
| 申请人 |
COOKSON ELECTRONICS, INC.;RAE, ALAN;SINGH, BAWA |
发明人 |
RAE, ALAN;SINGH, BAWA |
| 分类号 |
G01R31/02;H01L21/60;H01L23/36 |
主分类号 |
G01R31/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
