| 摘要 |
<p>Disclosed herein is an integrated silicone contractor comprises: a plurality of conductive silicone parts formed at a region which are in close contact with a plurality of ball leads of a ball grid array (BGA) type semiconductor device, the conductive silicone parts being made by mixing conductive metal powder with silicone; and a plurality of insulation silicone parts formed at a region which are not in close contact with the ball leads of the BGA type semiconductor device in such a fashion that each insulation silicone part is interposed between two adjacent insulation silicone parts to support the conductive silicone part, the insulation silicone parts serving as an insulation layer, wherein the conductive silicone part is formed on the top surface or/and the bottom surface thereof with a conductive reinforcing layer containing conductive powder having a higher density than that of conductive powder contained in the conductive silicone part so as to improve conductivity of the conductive reinforcing layer.</p> |
