发明名称 LEAD-FREE SOLDER ALLOY
摘要 A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
申请公布号 WO2006055259(A2) 申请公布日期 2006.05.26
申请号 WO2005US39769 申请日期 2005.11.04
申请人 METALLIC RESOURCES, INC.;ROTHSCHILD, STANLEY, R. 发明人 ROTHSCHILD, STANLEY, R.
分类号 C22C13/00 主分类号 C22C13/00
代理机构 代理人
主权项
地址