INTERCONNECT DEVICE AND THE ASSEMBLY SAME IS USED THEREIN
摘要
An assembly (118) is provided for mating a sensor (22) to a connector (24). The assembly includes an interconnect device (20, 120) and a housing (174a-174b). The interconnect device has conductive pathways (40, 154) provided thereon. The sensor is mounted on the interconnect device and is in electrical communication with the conductive pathways. The housing generally surrounds a portion of said interconnect device. The housing is formed of two portions which mate together. At least one flow tube (178) is attached to the housing. A gasket seals the sensor to the housing.
申请公布号
WO2006055698(A1)
申请公布日期
2006.05.26
申请号
WO2005US41655
申请日期
2005.11.17
申请人
MOLEX INCORPORATED;ZADEREJ, VICTOR;RAMEY, SAMUEL, C.;BEREK, DENNIS;KAMARAUSKAS, MICHAEL, R.;DAMBACH, PHILIP, J.
发明人
ZADEREJ, VICTOR;RAMEY, SAMUEL, C.;BEREK, DENNIS;KAMARAUSKAS, MICHAEL, R.;DAMBACH, PHILIP, J.