COMPONENT WITH BURIED DUCTILE CONDUCTIVE BUMPS AND METHOD FOR ELECTRIC CONNECTION BETWEEN SAID COMPONENT AND A COMPONENT PROVIDED WITH HARD CONDUCTIVE TIPS

摘要

The invention concerns a method for electric connection between a first component (10) comprising, on one side, a set of first contact pads (8) and a set of hard conductive tips (13) and a second component (11) comprising, on one side a set of second pads (9) and a set of ductile conductive bumps (14), which consists in placing opposite each other both sides and bringing them closer together such that the tips (13) may penetrate into said bumps (14), said bumps being buried. The invention also concerns a component equipped with a set of buried ductile conductive bumps.