HYBRID IC FOR ULTRASOUND BEAMFORMER PROBE

摘要

A hybrid integrated circuit package for a microbeamformer in an ultrasound probe includes a substrate, a driver circuit for generating transmit pulses to be transmitted to the transducer elements of the probe for producing a transmit beam, and a beamformer circuit including time delay circuits and a summation circuit, the time delay circuits being operatively arranged for receiving a plurality of reflected pulses from the transducer elements and delaying the reflected pulses and the summation circuit operatively arranged summing groups of the delayed reflected pulses for producing beamformed signals. The driver circuit is part of a high voltage integrated circuit device including said driver circuit. At least a portion of the beamformer circuit is part of a low voltage integrated circuit device, wherein the high voltage integrated circuit and the low voltage integrated circuit are mounted on the substrate.