| 发明名称 |
Semiconductor package |
| 摘要 |
A semiconductor package, containing two or more stacked IC devices attached to a substrate. Each of the IC devices has a plurality of electrical contact regions which are connected to the substrate by means of electrical connections. |
| 申请公布号 |
SG121705(A1) |
申请公布日期 |
2006.05.26 |
| 申请号 |
SG20020001096 |
申请日期 |
2002.02.21 |
| 申请人 |
UNITED TEST & ASSEMBLY CENTER LIMITED |
发明人 |
KHIANG WANG CHUEN;CHUAN KOH YONG;CHIN FONG KOK |
| 分类号 |
H01L21/98;H01L23/31;H01L23/538;H01L25/065 |
主分类号 |
H01L21/98 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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