<p>A heating floor initially heating at a very high rate, having high heat efficiency, capable of eliminating permanent deformation despite the fact that thin sheet-like bodies are used to reduce the overall thickness thereof to 18 mm or thinner so as to reduce running cost, and having excellent soundproofness. The heating floor comprises sheet-like body layers with thicknesses of 1 to 8 mm and a mat layer formed of a hard foam body in which a fluid pipe is assembled. The overall thickness of the heating floor is 18 mm or thinner. The compressive yield stress of the hard foam body measured under the conditions of an ordinary temperature and a compressibility of 10 mm/min according to JIS K 7220 is 0.5 MPa or higher.</p>
申请公布号
WO2006054335(A1)
申请公布日期
2006.05.26
申请号
WO2004JP17026
申请日期
2004.11.16
申请人
SEKISUI CHEMICAL CO., LTD.;OKABE, MASASHI;ASHIZUKA, RYOSUKE;UNE, SOICHI;HAGINO, TOMOKAZU;KAWASAKI, SYOHEI;MORITAKE, HIROSHI