METAL CLAD LAMINATED BOARD AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a metal clad laminated board and a circuit board being suitably usable for a substrate application for mounting an electric/electronic part such as FPC or TAB tape or the like and an alignment or inspection on the electric/electronic mounting such as a circuit formation or IC or the like and on mounting to a substrate being easily made in which an aromatic polyimide film is good at a dimensional stability. SOLUTION: The laminated board in which a metal layer is laminated directly or through an adhesive to one side or both sides of the aromatic polyimide film with a thickness of 10-75μm, in which an absorption coefficient of the aromatic polyimide film is≤15×10-3/μm at wave length of 500 nm,≤5×10-3/μm at wave length of 600 nm, a coefficient of linear expansion (50-200°C) is 0.5×10-5to 2.5×10-5cm/cm/°C, a water absorption of≤2.5%, and gives a circuit board having a good transparency distinguishable a circuit pattern by forming a circuit pattern on the metal layer in the laminated board and by irradiating a light from an opposite side of the circuit face. COPYRIGHT: (C)2006,JPO&NCIPI