发明名称 HEATING/HEAT INSULATING DEVICE OF CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a heating/heat insulating device of a circuit which can appropriately heat only the required region of a circuit by a relatively simple structure. SOLUTION: On a printed wiring board 5 mounting a plurality of circuits 3-1, 3-2 as parts required to heat, a plurality of heating resistors 1-1 to 1-6 disposed near around each of circuits 3-1, 3-2 flush with a face mounting these circuits, temperature sensors 2-1, 2-2 disposed respectively on each of the circuits 3-1, 3-2 and a CPU (controller) 4 which monitors temperature information from the temperature sensors 2-1, 2-2 and controls to enable the plurality of heating resistors 1-1 to 1-6 respectively independently. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006135186(A) 申请公布日期 2006.05.25
申请号 JP20040324113 申请日期 2004.11.08
申请人 NEC CORP 发明人 FURUKAWA EIICHI
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
代理机构 代理人
主权项
地址