| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of preventing a semiconductor chip from being damaged by reducing the load on the semiconductor chip, and to provide a semiconductor device that uses the wiring board. SOLUTION: In the wiring board on which wiring for packaging the semiconductor chip whose thickness is 150μm or smaller is arranged, width A of circuit wiring 13 in a region 12 where the semiconductor chip is packaged is set to 145μm or smaller. COPYRIGHT: (C)2006,JPO&NCIPI
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