| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonding material which has, as an adhesive material for an electronic component and a support element, a good hot-adhesiveness and a high-temperature soldering resistance while it is mounted, and also are excellent in low stress nature and low-temperature adhesiveness. SOLUTION: This die bonding material is a film die bonding material whose elastic modulus is less than 0.1 MPa at 250°C or higher before adhered and more than 1 MPa and not more than 8 MPa at 250°C after heat-cured. This die bonding material contains a diamine containing not less than 3 mol%, out of all diamines, of 1,1,3,3-tetramethyl-1,3-bis(3-aminopropyl)disiloxane, a polyimide resin which is obtained by the reaction with a tetracarboxylic acid dianhydride and whose Tg is not more than 200°C, 1-100 pts.wt., against 100 pts.wt. of the polyimide resin, of a glycidyl ether epoxy resin of phenol, not more than 4,000 pts.wt., against 100 pts.wt. of the polyimide resin, of a filler selected from the group consisting of silica, alumina, boron nitride, titania, glass, iron oxide, a ceramic, and a copper powder, and a hardener. COPYRIGHT: (C)2006,JPO&NCIPI
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