METHOD FOR INTERIM PRESSURE BONDING OF ANISOTROPICALLY ELECTRICALLY CONDUCTIVE ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for the interim pressure bonding of an anisotropically electrically conductive adhesive film to a circuit member while suppressing foaming. SOLUTION: The method for the interim pressure bonding of an anisotropically electrically conductive adhesive film comprises making an interim pressure bonding of the anisotropically electrically conductive adhesive film 1 to a circuit member 2 using a laminator 10. A 2nd version of this method comprises making an interim pressure bonding of the anisotropically electrically conductive adhesive film 1 to a circuit member 2 while applying ultrasonic waves or microwaves to the film. A 3rd version of this method comprises making an interim pressure bonding of the anisotropically electrically conductive adhesive film 1 to a circuit member 2 while bringing the interim pressure bonding part for the circuit member 2 to a vacuum. COPYRIGHT: (C)2006,JPO&NCIPI