| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding method and a bonder capable of normal temperature bonding easily by bringing the portions to be bonded surely into clean state suitable for bonding before being bonded. <P>SOLUTION: When articles each having a bonding portion on the surface of a substrate are bonded to each other, the bonding portions are bonded after the surface thereof is cleaned with energy wave under reduced pressure. Subsequently, they are cleaned under a predetermined degree of vacuum suitable for cleaning and then the degree of vacuum is raised furthermore before the bonding portions are bonded. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
