| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the reliability of solder junctions on a buildup printed wiring board taking a stack via structure. <P>SOLUTION: In the junction structure of a buildup printed wiring board with electronic components, stack vias on the outermost layer are formed with conductive paste. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
